Spinner Magnetron

The Spinner magnetron with a rotating magnetic system is designed for thin-film deposition in processes where high coating uniformity and a high deposition rate are critical. Rotation of the magnetic system ensures a more uniform distribution of the sputtering zone across the target surface and broadens the erosion zone, increasing target material utilization and improving the stability of the coating deposition process. The rotating magnetic system also allows the target-to-substrate distance to be reduced while maintaining deposition uniformity, improving the utilization efficiency of the sputtered material. Spinner is designed for a target diameter of 202 ± 1 mm and is primarily intended for microelectronics applications, as well as research and technological processes with stringent coating uniformity requirements.